If it's available, I'd love to use your solder pot... hand soldering all the thru hole stuff is slow, but manageable.If only I could run the SMT & solder pot afterhours so you didn't have to nuke your work area. I'll ask to see if that's possible.
We'll see how well the next build goes with leaded solder. I'm using a 5 mil stencil now... don't want to drop down to 4 mil, as that reduces the paste depth everywhere else, too. I'll play around with the aperture size is the lead reflow doesn't work out. On these beta units I'm just hand soldering the pads with lead, then sucking all the excess up with copper braid... also a chore, and won't be sustainable for production. I certainly wish LTC would make the 6804 in a wider-spaced footprint.If you need to reduce bridging for the 0.65 pitch components, you can have the stencil fab house change the aperture design to have the same volume, but have greater spacing between deposits like this, and ~4mil stencils seem to work really well. If a stencil redesign might happen, Ping me, there might be other things to make this more robust.
I'm always down for help. I just uploaded the first instruction video on how people can help:Hoping I can contribute somehow to this massive project. (Test drive looked awesome!)